Sensonor AS是挪威MEMS陀螺仪和IMU的生产商和开发商。自2009年以来，Sensonor一直专注于MEMS陀螺仪，主要产品线是陀螺仪STIM202，STIM210和IMU STIM300。该公司拥有60名员工，位于挪威Vestfold，在Horten和Skoppum设有办事处和工厂。

Sensonor的主要产品一直是MEMS制造的压力传感器，陀螺仪和惯性测量系统。主要产品是惯性测量单元STIM210和STIM300。

Sensonor及其技术的根源可以追溯到1965年。1985年，公司开始以Sensonor的名义作为独立实体运营，直到2003年被英飞凌科技收购。2009年，公司从英飞凌分拆出来，由当地支持MBO投资者继续关注基于MEMS的传感器，但针对需要高精度传感器的应用和市场，特别关注惯性（陀螺仪和IMU）。从2012年起，Sensonor一直归瑞士投资集团所有。

Sensonor总部位于挪威奥斯陆以南约100公里处的Horten，在全球MEMS行业的发展中发挥了重要作用。多年来，已经向客户发送了超过2.5亿个压力传感器，超过2.5亿个加速度计和超过200万个陀螺仪，用于多种类型的应用。这一成功的最重要原因可能是客户在使用Sensonor产品时遇到的极低故障率;运送1000万件零件不到1次失败。

Sensonor的硅传感器的传统更进一步。早在六十年代中期，母公司AME开始使用基于压阻式微机械硅应变计的压力传感器和加速度计，并从七十年代末开始使用蚀刻膜片硅传感器。

令人印象深刻的世界“第一”清单显示了Sensonor为全球客户提供创新解决方案的奉献精神和能力：

首款用于飞机发动机控制的MEMS压力传感器（AE880  -  1985）
用于气囊系统的首款MEMS加速度计（S64A-1987）
用于井下井监测的第一台光学压力传感器（PP05  -  1990）
首款低成本气囊加速度计（SA20  -  1992）
首个用于轮胎压力测量的集成微系统（SP13  -  1998）
首款低成本汽车陀螺仪（SAR10  -  2003）

在过去的十年中，MEMS技术在汽车和消费者批量应用中发挥着越来越重要的作用。其原因很明显，并且与传统技术相比，MEMS的优势在于：

更低的成本 - 更小的尺寸 - 更轻的重量 - 更低的功率 - 更坚固
与汽车和消费者中的MEMS成功相反，很少有MEMS在高精度传感应用中发挥重要作用的例子。 Sensonor接受了挑战，为使用高精度产品的客户带来了同样有能力和可靠的优势。

在九十年代早期，Sensonor开发了三叠层密封晶圆键合技术，该技术具有极佳的长期性能。简而言之，该技术基于微机械加工的单晶硅和微机械加工的玻璃晶片的组合。然后使用阳极键合和受控的气体压力将这些晶片粘合在一起，通过利用掩埋在外延硅层下面的半导体扩散产生到键合腔中的电连接。

客户使用Sensonor的压力传感器以及使用我们的ButterflyGyroTM传感器的客户已经在高精度应用中探索了这些稳定的长期性能。 Sensonor在此平台上推出了许多高精度产品，旨在：

取代传统的高精密技术，在较小的外壳中使用较低的功率，同等性能，提供更低的成本和更好的坚固性
通过在小型外壳中提供低成本和高稳健性，实现新的高精度应用，使用当今市场无法提供的低功耗
处于先进技术的最前沿需要最有效的研究，开发和制造安排。 Sensonor拥有自己的150毫米晶圆厂，用于先进的异构MEMS工艺和几个配备齐全的装配和测试线。除了我们自己的员工，Sensonor还与合作伙伴合作开发解决方案，这些合作伙伴是各自领域的全球领导者。

Sensonor AS is a Norwegian producer and developer of MEMS gyros and IMUs. Since 2009 the company has focused on MEMS gyros, and the main product line has been the gyros STIM202, STIM210 and the IMU STIM300. The company has 60 employees and is localised in Vestfold, Norway, with offices and fabs in Horten and at Skoppum.

The main product of Sensonor has long been MEMS manufactured pressure sensors, gyros and inertial measurement systems. The main products are the inertial measurement units STIM210 and STIM300.

The roots of Sensonor and its technology go back to 1965. In 1985 the Company started operating as an independent entity under the name Sensonor, until it was acquired by Infineon Technologies in 2003. In 2009 the company split from Infineon in a MBO supported by local investors to continue its focus on MEMS based sensors, however aiming at applications and markets requiring high precision sensors with a special focus on inertial (Gyro and IMU). From 2012 Sensonor has been under ownership of a Swiss based investment group.

Based out of Horten, about 100 km south of Oslo in Norway, Sensonor has for more than 25 years played a significant role in the development of the global MEMS industry. Over the years, more than 250 million pressure sensors, more than 250 million accelerometers, and more than 2 million gyros have been shipped to customers for use in numerous type of applications. Probably the most important reason for this success is the extremely low failure rate experienced by customers relaying on Sensonor products; less than 1 failure in 10 million parts shipped.

The legacy of silicon based sensors at Sensonor goes even further back. Already in the mid sixties the mother company, AME, started up with pressure sensors and accelerometers based on piezoresistive micromachined silicon strain gauges and from the late seventies with etched diaphragm silicon sensors.

The impressive list of world "firsts" clearly shows the dedication and capability to provide global customers with innovative solutions:

First MEMS pressure sensor for Aircraft Engine Control (AE880 - 1985)
First MEMS accelerometer for Air Bag Systems (S64A - 1987)
First optical pressure sensor for Down Hole Well Monitoring (PP05 - 1990)
First low cost Air Bag Accelerometer (SA20 - 1992)
First integrated micro system for Tire Pressure Measurement (SP13 - 1998)
First low cost Automotive Gyro (SAR10 - 2003)
During the past ten years MEMS technology has played a more and more dominant role within automotive and consumer volume applications. The reason is obvious and explained by the superior advantages of MEMS compared to conventional technologies:

Lower cost - Smaller size - Lower weight - Less Power - More Robust
In opposition to the MEMS success within automotive and consumer, there are very few examples where MEMS play an important role within High Precision sensing applications. Sensonor has taken the challenge to bring the same capable and reliable benefits to customers operating with High Precision products.

During the early nineties, Sensonor developed its triple stack hermetic wafer bonding technology that has shown extremely good long term properties. In short the technology is based on a combination of micro machined single crystalline silicon and micro machined glass wafers. These wafers are then bonded together using anodic bonding and a controlled gas pressure creating electrical connections into the bonded cavity by utilizing semiconductor diffusions buried under a layer of epitaxial silicon.

These stable long term properties have been explored within High Precision applications by customers using our pressure sensors as well as by customers using our ButterflyGyroTM sensors. Sensonor has on this platform launched a number of High Precision products aiming to:

Replace traditional High Precision technology by offering lower cost and better robustness in smaller housings using less power at equal performance
Enable new High Precision applications by offering low cost and high robustness in small housings using low power at performance levels not available in today's market
Being in the forefront of advanced technology requires the most efficient research, development and manufacturing arrangements. Sensonor operates its own 150 mm wafer fab for advanced heterogeneous MEMS processes and several fully equipped assembly and test lines. Additionally to our own staff Sensonor develop solutions in cooperation with partners that are global leaders in their respective areas.